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Nickel Oxide Sputtering Targets (NiO)

Nickel Oxide Sputtering Targets (NiO)
Material Type Nickel Oxide
Symbol NiO
Color/Appearance Green, Crystalline Solid
Melting Point (°C) 1,984
Theoretical Density (g/cc) 6.67
Z Ratio **1.00
Sputter RF-R
Type of Bond Indium, Elastomer
Comments Dissociates on heating.

General

Nickel(II) oxide is the chemical compound with the formula NiO. It is notable as being the only well-characterized oxide of nickel (although nickel(III) oxide, Ni2O3 and NiO2 have been claimed). The mineralogical form of NiO, bunsenite, is very rare. It is classified as a basic metal oxide. Several million kilograms are produced in varying quality annually, mainly as an intermediate in the production of nickel alloys.

Material Notes

Nickel(II) Oxide Sputtering Targets, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.
 



Other Information of Nickel Oxide Sputtering Targets

Applications
  Ferroelectric
• Gate Dielectric

• For CMOS

Features
• High purity
• Custom Sizes Available

Manufacturing Process
• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

Options
99.9% ex Strontium Minimum Purity

•Up to 12'' Diameter Targets Available

•Planar Tiles Up to 8'' X 5'' for Larger Target Configurations

 
 
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