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Nickel Sputtering Targets (Ni)

Nickel Sputtering Targets (Ni)
Material Type Nickel
Symbol Ni
Atomic Weight 58.6934
Atomic Number 28
Color/Appearance Lustrous, Metallic, Silvery Tinge
Thermal Conductivity 91 W/m.K
Melting Point (°C) 1,453
Coefficient of Thermal Expansion 13.4 x 10-6/K
Theoretical Density (g/cc) 8.91
Ferromagnetic Magnetic Material
Z Ratio 0.331
Sputter DC
Max Power Density*
(Watts/Square Inch)
Comments Alloys with W/Ta/Mo. Smooth adherent films.


Nickel is a silvery-white lustrous metal with a slight golden tinge. It is widely used in production of sponge nicke and decorative coating area etc.Nickel can form a decorative coating on ceramic surfaces or a solder layer in circuit device fabrication when evaporated in vacuum. It is often sputtered to form layers in the production of magnetic storage media, fuel cells, and sensors. AEM can produce Nickel sputtering targets with high purity and fine grain.Under the same conditions, the coating film is more uniform than the similar products, and the coating area is increased by 10% to 20%.

Material Notes

Purity: 99.9%, 99.96%, 99.99%, 99.995%, 99.999%
Circular: Diameter <= 14inch, Thickness >= 1mm
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm

Targets Type: Planar sputtering target, Rotary sputtering target

Other Information of Nickel Sputtering Targets

• Semiconductor
• Flat panel displays
Competitive pricing
• High purity
• Grain refined, engineered microstructure (the average grain size < 100 um)
• Semiconductor grade

Manufacturing Process

• Casting & Grain refinement
  Forging, Rolling, Annealing, Micrography
• Maching-Measurement
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
99.9% minimum purity
• Semiconductor grade aluminum alloys available
  Ni/Cr, Ni/V, Ni/Fe, Ni3/Al, Ni/Cr/Al/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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