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Nickel Sputtering Targets (Ni)

Nickel Sputtering Targets (Ni)
Material Type Nickel
Symbol Ni
Atomic Weight 58.6934
Atomic Number 28
Color/Appearance Lustrous, Metallic, Silvery Tinge
Thermal Conductivity 91 W/m.K
Melting Point (°C) 1,453
Coefficient of Thermal Expansion 13.4 x 10-6/K
Theoretical Density (g/cc) 8.91
Ferromagnetic Magnetic Material
Z Ratio 0.331
Sputter DC
Max Power Density*
(Watts/Square Inch)
Comments Alloys with W/Ta/Mo. Smooth adherent films.


Nickel is a chemical element with symbol Ni and atomic number 28. It is a silvery-white lustrous metal with a slight golden tinge. Nickel belongs to the transition metals and is hard and ductile. Pure nickel, powdered to maximize the reactive surface area, shows a significant chemical activity, but larger pieces are slow to react with air under standard conditions because an oxide layer forms on the surface and prevents further corrosion (passivation). Even so, pure native nickel is found in Earth's crust only in tiny amounts, usually in ultramafic rocks, and in the interiors of larger nickel–iron meteorites that were not exposed to oxygen when outside Earth's atmosphere.

Material Notes

Nickel Sputtering Targets, Purity is 99.7%, 99.995%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Other Information of Nickel Sputtering Targets

• Semiconductor
• Flat panel displays
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
99.995% minimum purity
• Semiconductor grade aluminum alloys available
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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