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Nickel Titanium Sputtering Targets (Ni/Ti)

Nickel Titanium Sputtering Targets (Ni/Ti)
Material Type Nickel Titanium
Symbol Ni/Ti
Color/Appearance bright silvery
Thermal Conductivity 0.18 W/cm·K
Melting Point (°C) 1310 °C
Coefficient of Thermal Expansion 11×10−6/°C
Density 6.45 g/cm3
Sputter DC
Type of Bond Indium, Elastomer


It is a Nickel Titanium metal alloy with some unique properties. It is also known as Nickel titanium. This alloy exhibits the superelasticity or pseudoelasticity and the shape memory properties. It means this unique metal can remember its original shape and shows great elasticity under stress. The shape memory and superelasticity properties are the most unique properties of this alloy. The shape memory property allows this metal to “remember” its original shape and retain it when heated above its transformation-temperature. It happens due to the different crystal structures of nickel and titanium. This pseudo-elastic metal also shows incredible elasticity which is approximately 10 to 30 times more than that of any ordinary metal. 

Material Notes of Nickel Titanium Sputtering Targets

Nickel Titanium Sputtering Targets (Ni/Ti) Sputtering Targets, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Other Information of Gold Tin Sputtering Targets

• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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