Nickel Titanium Sputtering Targets (Ni/Ti)
| Material Type | Nickel Titanium |
| Symbol | Ni/Ti |
| Color/Appearance | bright silvery |
| Thermal Conductivity | 0.18 W/cm·K |
| Melting Point (°C) | 1310 °C |
| Coefficient of Thermal Expansion | 11×10−6/°C |
| Density | 6.45 g/cm3 |
| Sputter | DC |
| Type of Bond | Indium, Elastomer |
Nickel Titanium Sputtering Target
It is a Nickel Titanium metal alloy with some unique properties. It is also known as Nickel titanium. This alloy exhibits the superelasticity or pseudoelasticity and the shape memory properties. It means this unique metal can remember its original shape and shows great elasticity under stress. The shape memory and superelasticity properties are the most unique properties of this alloy. The shape memory property allows this metal to “remember” its original shape and retain it when heated above its transformation-temperature. It happens due to the different crystal structures of nickel and titanium. This pseudo-elastic metal also shows incredible elasticity which is approximately 10 to 30 times more than that of any ordinary metal.
Nickel Titanium Sputtering Target Information
Nickel Titanium Sputtering Targets (Ni/Ti)
Purity is 99.9%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Other Information of Nickel Titanium Sputtering Target
Applications• Semiconductor• Chemical vapor deposition (CVD) • Physical vapor deposition (PVD) display |
Features• Competitive pricing• High purity • Grain refined, engineered microstructure • Semiconductor grade |
Manufacturing Process• RefiningThree-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 99.9% minimum purity• Planar circular targets up to 18'' (457mm) diameter • Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations • Smaller sizes also available for R&D applications • Sputtering target bonding service |
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