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Molybdenum Sputtering Targets (Mo)

Molybdenum Sputtering Targets (Mo)
Material Type Molybdenum
Symbol Mo
Atomic Weight 95.96
Atomic Number 42
Color/Appearance Grey, Metallic
Thermal Conductivity 139 W/m.K
Melting Point (°C) 2,617
Coefficient of Thermal Expansion 4.8 x 10-6/K
Theoretical Density (g/cc) 10.2
Z Ratio 0.257
Sputter DC
Max Power Density*
(Watts/Square Inch)
Type of Bond Indium, Elastomer
Comments Films smooth, hard. Careful degas required.


Molybdenum is a silvery-grey metal with a Mohs hardness of 5.5. It has a melting point of 2,623 °C (4,753 °F); of the naturally occurring elements, only tantalum, osmium, rhenium, tungsten, and carbon have higher melting points.[6] Weak oxidation of molybdenum starts at 300 °C (572 °F). It has one of the lowest coefficients of thermal expansion among commercially used metals. The tensile strength of molybdenum wires increases about 3 times, from about 10 to 30 GPa, when their diameter decreases from ~50–100 nm to 10 nm.

Material Notes

Molybdenum Sputtering Targets, Purity is 99.95%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.


Other Information of Molybednum Sputtering Targets

• Semiconductor
• Flat panel displays
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
99.95% minimum purity
• Semiconductor grade aluminum alloys available
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

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