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Tungsten Sputtering Targets (W)

Tungsten Sputtering Targets (W)
Material Type Tungsten
Symbol W
Atomic Weight 183.84
Atomic Number 74
Color/Appearance Grayish White, Lustrous, Metallic
Thermal Conductivity 174 W/m.K
Melting Point (°C) 3,410
Coefficient of Thermal Expansion 4.5 x 10-6/K
Theoretical Density (g/cc) 19.25
Z Ratio 0.163
Sputter DC
Max Power Density*
(Watts/Square Inch)
100
Type of Bond Indium, Elastomer
Comments Forms volatile oxides. Films hard and adherent.

General

Of all metals in pure form, tungsten has the highest melting point (3422℃, 6192 ℉), lowest vapor pressure (at temperatures above 1650℃, 3000 ℉) and the highest tensile strength. Although carbon remains solid at higher temperatures than tungsten, carbon sublimes at atmospheric pressure instead of melting, so it has no melting point. Tungsten has the lowest coefficient of thermal expansion of any pure metal. The low thermal expansion and high melting point and tensile strength of tungsten originate from strong covalent bonds formed between tungsten atoms by the 5d electrons. Alloying small quantities of tungsten with steel greatly increases its tou.

Material Notes

Tungsten Sputtering Targets, Purity is 99.95%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
 


Other Information of Tungsten Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.999% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48''(1200mm) X 15.75''(400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 

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