Tungsten Sputtering Targets (W)


Material Type | Tungsten |
Symbol | W |
Atomic Weight | 183.84 |
Atomic Number | 74 |
Color/Appearance | Grayish White, Lustrous, Metallic |
Thermal Conductivity | 174 W/m.K |
Melting Point (°C) | 3,410 |
Coefficient of Thermal Expansion | 4.5 x 10-6/K |
Theoretical Density (g/cc) | 19.25 |
Z Ratio | 0.163 |
Sputter | DC |
Max Power Density* (Watts/Square Inch) |
100 |
Type of Bond | Indium, Elastomer |
Comments | Forms volatile oxides. Films hard and adherent. |
General
Of all metals in pure form, tungsten has the highest melting point (3422℃, 6192 ℉), lowest vapor pressure (at temperatures above 1650℃, 3000 ℉) and the highest tensile strength. Although carbon remains solid at higher temperatures than tungsten, carbon sublimes at atmospheric pressure instead of melting, so it has no melting point. Tungsten has the lowest coefficient of thermal expansion of any pure metal. The low thermal expansion and high melting point and tensile strength of tungsten originate from strong covalent bonds formed between tungsten atoms by the 5d electrons. Alloying small quantities of tungsten with steel greatly increases its tou.
Material Notes
Tungsten Sputtering Targets, Purity is 99.95%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Other Information of Tungsten Sputtering Targets
Applications • Electronics • Semiconductor • Flat panel displays |
Features • Competitive pricing • High purity • Grain refined, engineered microstructure • Semiconductor grade |
Manufacturing Process • Refining Three-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options • 99.999% minimum purity • Semiconductor grade aluminum alloys available Al/Si,Al/Cu,Al/Cu/Si • Planar circular targets up to 18'' (457mm) diameter • Planar tiles up to 48''(1200mm) X 15.75''(400mm) for larger target configurations • Smaller sizes also available for R&D applications • Sputtering target bonding service |


