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Tungsten Disilicide Sputtering Targets (WSi2)

Tungsten Disilicide Sputtering Targets (WSi2)
Material Type Tungsten Silicide
Symbol WSi2
Melting Point (°C) 2,165
Theoretical Density (g/cc) 9.4
Z Ratio 1.00
Sputter RF
Max Power Density*
(Watts/Square Inch)
15
Type of Bond Indium, Elastomer

General

Tungsten silicide (WSi2) is an inorganic compound, a silicide of tungsten. It is an electrically conductive ceramic material. Tungsten silicide can be used in microelectromechanical systems and for oxidation-resistant coatings. 

Material Notes

Tungsten Disilicide Sputtering Target, Purity is 99.5%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.
 



Other Information of Tungsten Disilicide Sputtering Targets
 

Applications
  PVD and CVD display
• Semiconductor

• Optical

Features
• High purity
• Custom Sizes Available

 

Manufacturing Process
• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

Options
• 99% Minimum Purity

• Up to 12'' Diameter Targets Available

• Planar Tiles Up to 8'' X 5'' for Larger Target Configurations

 

 

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