Thin Film Substrate
Tungsten Disilicide Sputtering Targets (WSi2)
|Material Type||Tungsten Silicide|
|Melting Point (°C)||2,165|
|Theoretical Density (g/cc)||9.4|
Max Power Density*
|Type of Bond||Indium, Elastomer|
Tungsten silicide (WSi2) is an inorganic compound, a silicide of tungsten. It is an electrically conductive ceramic material. Tungsten silicide can be used in microelectromechanical systems and for oxidation-resistant coatings.
Tungsten Disilicide Sputtering Target, Purity is 99.5%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.
Other Information of Tungsten Disilicide Sputtering Targets
• Cleaning and final packaging, Cleaned for use in vacuum,
• Up to 12'' Diameter Targets Available
• Planar Tiles Up to 8'' X 5'' for Larger Target Configurations