Sputtering Targets of AEM Deposition for LSI

views, Updated: 2021-09-22

LSI's sputtering targets are used as indispensable materials for circuitry elements and wiring of VLSI and USLI semiconductors. The rapid advancement of integrity and the accompanying demands for faster devices require a broad range of high-quality sputtering targets.

The quality sputtering targets of the AEM Deposition have been enjoying a high reputation and reliance from our customers. The AEM Deposition Works is also praised because it is structured to develop the necessary technology and manufacture the sputtering targets promptly to meet the semiconductor industry's continually changing technology needs.

The sputtering targets manufactured at the AEM Deposition are used in various parts of VLSI and ULSI semiconductors such as gate elements (Ti, W-Si, etc.), barriers(Ti, Ta, W-Ti, etc.), metallization(Cu, Al-Alloy, etc.), and contacts(Ti, Al, etc.). Among others, Cu, Cu-Alloy, Ta, and other particular sputtering targets that are presently spotlighted as the newest materials for semiconductors are highly acclaimed. With speed and quality as its priority, the AEM Deposition also develops a wide range of technology spurred by the demand for more layers in the semiconductor circuitry while maintaining a close relationship with the customer as well as the sputtering equipment manufacturers. The development of next-generation materials for semiconductors such as ferroelectric materials is also energetically conducted at the AEM Deposition.

The sputtering targets of AEM Deposition feature the following advantages:

1. They are made of high purity materials.

2. Thanks to our unique control of the material properties such as metal structure and orientation, the generation of particles is minimized, and excellent uniformity of the film thickness and the film characteristics are maintained.

3. The particle generation is also minimized out of the powder metal targets due to its high density.

4. Thanks to the sputtering targets' uniformity, only a short burn-in time is required for the initial stage of sputtering our new targets.

5. To cope with the trend of using high power in sputtering, we supply backing plates of a variety of materials and make and feature diffusion bonding with different materials.

6. At AEM Deposition, up-to-date models of sputtering equipment are also used, thanks to which the AEM Deposition. We can sputtering target products to check the properties of the sputtering films, which in turn be used for developing higher quality and higher performance sputtering targets to be offered to our customers.

Sputtering Targets of AEM Deposition for LSI

The sputtering targets of AEM Deposition feature the following advantages:

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