List of Sputtering Targets for Semiconductor Coating
With the rapid development in the information technology field, integrated circuits' integration degree requirements are higher than ever. The size of unit devices in the circuit is shrinking, and the size of components is from millimeter level to micron level, then to nanometer level. Each unit device comprises a substrate, insulating layer, dielectric layer, conductor layer, and protective layer. The dielectric layer, conductor layer, and even protective layer all need sputtering coating processes, so sputtering target is one of the core materials for preparing integrated circuits.
Sputtering target for semiconductor coating
Sputtering target material for a semiconductor has a high requirement for the purity of the target material, which is generally more than 4N or 5N, so the target material for semiconductor coating is also costly. The sputtering targets for semiconductor coating mainly include W sputtering target, W-Ti sputtering target, Ti sputtering target, Ta sputtering target, Al sputtering target, Cu sputtering target. Further details are as follows:
Tungsten Sputtering Target
Tungsten has the highest melting point (3422℃, 6192 ℉) of all metals in pure form. It has the lowest vapor pressure (at temperatures above 1650℃, 3000 ℉) and the highest tensile strength. Although Carbon remains stable at higher temperatures than tungsten, carbon sublimes at atmospheric pressure instead of melting, so it has no melting point. Tungsten has the lowest coefficient of thermal expansion of any pure metal. The low thermal expansion and high melting point, and tensile strength of tungsten originate from strong covalent bonds formed between tungsten atoms by the 5d electrons. Alloying small quantities of tungsten with steel dramatically increases its toughness.
Titanium Sputtering Target
Titanium sputtering targets are commonly used in hardware tool coating, decorative coating, semiconductor components, and flat display coating. It is one of the core materials for preparing integrated circuits, and purity usually requires over 99.99%. AEM offers Titanium alloy targets such as Tungsten Titanium (W/Ti 90/10 wt%) sputtering target, an essential material for the semiconductor and solar industry. The W/Ti sputtering target density can reach over 14.24 g/cm3, and the purity can reach 99.995%.
Tantalum Sputtering Target
Tantalum is a dark (blue-gray) metal with high density, good ductile, and highly conductive heat and electricity. Since tantalum can form thin oxides and the film has a protective effect, tantalum is widely used as a base material in the manufacturing process of electrolytic capacitors. Tantalum sputtering targets are applied in microelectronic fields, such as thermal ink-jet print head, copper plating, and through-silicon via technology. Since high-temperature inks can cause cavitation in some ink-jet printing machines, the tantalum sputtering target can be the anti-cavitation films to protect the ink facilities. Some tantalum sputtering targets are also applied in the glass coating.
Aluminum Sputtering Target
Aluminum is a silvery-white, metallic material. It can be found in kitchen utensils, cars, street lights, and aluminum foil in food packaging. Although it is not a strong material, it is a good conductor of heat and electricity and can form an oxide layer resistant to corrosion. If evaporated in a vacuum, aluminum layers form a reflective coating found on telescopes, automotive headlamps, mirrors, packages, and toys. The aluminum sputtering target is widely used in the aerospace, automotive lighting, OLED, and optical industries. Some high purity aluminum targets are used in the semiconductor chip, flat panel display, and solar cell industries.
Copper Sputtering Target
Copper is a ductile metal with very high thermal conductivity, electrical conductivity, ductility, corrosion resistance. A freshly exposed surface of pure copper has a reddish-orange color. High-purity copper is used as various wires in the electrical and electronics industry, bonding wires for electronic packaging, high-quality audio cables and integrated circuits, liquid crystal display sputtering targets, and ion plating. It is also an indispensable valuable material in atomic energy, rockets, missiles, aviation, space navigation, and metallurgical industries. AEM offers high purity OFC, Cupronickel, and alloy products as per requirement.
Tungsten Titanium Sputtering Target
AEM deposition, as a sputtering target manufacturer
, we provide not only sputtering targets for glass, but also sputtering targets for other fields. Such as pure metal sputtering target, alloy sputtering target, ceramic oxide sputtering target and so on. The details are as follows:
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