List of Sputtering Targets for Semiconductor Coating
With the rapid development of information technology, the requirements of integration degree of integrated circuit are higher and higher. The size of unit devices in the circuit is shrinking, and the size of components is from millimeter level to micron level, then to nanometer level. Each unit device is composed of substrate, insulating layer, dielectric layer, conductor layer and protective layer. Among them, the dielectric layer, conductor layer and even protective layer all need sputtering coating process, so sputtering target is one of the core materials for preparing integrated circuit.
Sputtering target for semiconductor coating
Sputtering target material for semiconductor has a high requirement for the purity of the target material, which is generally more than 4N or 5N, so the target material for semiconductor coating is also very expensive. The sputtering targets for semiconductor coating
mainly include W sputtering target, W-Ti sputtering target, Ti sputtering target, Ta sputtering target, Al sputtering target, Cu sputtering target, etc. The details are as follows:
Tungsten Sputtering Target
Of all metals in pure form, tungsten has the highest melting point (3422℃, 6192 ℉), lowest vapor pressure (at temperatures above 1650℃, 3000 ℉) and the highest tensile strength. Although carbon remains solid at higher temperatures than tungsten, carbon sublimes at atmospheric pressure instead of melting, so it has no melting point. Tungsten has the lowest coefficient of thermal expansion of any pure metal. The low thermal expansion and high melting point and tensile strength of tungsten originate from strong covalent bonds formed between tungsten atoms by the 5d electrons. Alloying small quantities of tungsten with steel greatly increases its tou.
Titanium Sputtering Target
Titanium sputtering targets are common used in hardware tool coating, decorative coating, semicondutor components and Flat display coating. It is one of the core materials for preparing integrated circuits, and the purity usually require over 99.99%. AEM also can provide Titanium alloy targets such as tungsten titanium (W/Ti 90/10 wt%) sputtering target, which is an improtant material for semiconductor and solar industry. The density of W/Ti sputtering target we can reach over 14.24 g/cm3, and the purity can reach to 99.995%.
Tantalum Sputtering Target
Tantalum is a dark (blue-gray) metal with high dense, good ductile and highly conductive of heat and electricity. Since tantalum can form thin oxides and the film has a protective effect, tantalum is widely used as a base material in the manufacturing process of electrolytic capacitors. Tantalum sputtering targets are applicated in microelectronic fileds, such as thermal inkjet print head, copper plating and through-silicon via technology. Since high-temperature inks can cause cavitation in some ink-jet printing apparatuses, the tantalum sputteurng target can be as the anti-cavitation films to protect the ink facilities. Some tantalum sputtering targets also applicated in glass coating.
Aluminum Sputtering Target
Aluminum is a silvery-white, metallic material. It can be found in kitchen utensils, cars, street lights, and the popular aluminum foil food packaging. Although it is not a strong material, it is a good conductor of heat and electricity and is able to form an oxide layer that is resistant to corrosion. When evaporated in a vacuum, aluminum layers form a reflective coating found on telescopes, automotive headlamps, mirrors, packages, and toys. Aluminum sputtering target is widely used in the aerospace, automotive lighting, OLED, and optical industries. Some high purity aluminum targets are used in semiconductor chip, flat panel display, solar cell industries.
Copper Sputtering Target
Copper is a ductile metal with very high thermal conductivity, electrical conductivity, ductility, corrosion resistance. A freshly exposed surface of pure copper has a reddish-orange color. High-purity copper is used as various wires in the electronics industry, bonding wires for electronic packaging, high-quality audio cables and integrated circuits, liquid crystal display sputtering targets, and ion plating. It is also an indispensable valuable material in atomic energy, rockets, missiles, aviation, space navigation, and metallurgical industries. AEM can provide high purity OFC,
Cupronickel and alloy products as you requested.
Tungsten Titanium Sputtering Target
AEM deposition, as a sputtering target manufacturer
, we provide not only sputtering targets for glass, but also sputtering targets for other fields. Such as pure metal sputtering target, alloy sputtering target, ceramic oxide sputtering target and so on. The details are as follows:
Interested friends can click the relevant links to specific product pages. You can also contact us directly by email.E-mail: [email protected]