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AEM Deposition

Lanthanum Aluminate Sputtering Targets (LaAlO3)

Lanthanum Aluminate Sputtering Targets (LaAlO3)
Lanthanum Aluminate Sputtering Targets (LaAlO3)
Material Type Lanthanum Aluminate
Symbol LaAlO3
Color/Appearance White / Off-white, Crystalline Solid
Melting Point (°C) 2,080
Theoretical Density (g/cc) 6.52
Z Ratio N/A
Sputter RF, RF-R, DC
Max Power Density*
(Watts/Square Inch)
Type of Bond Indium, Elastomer


The crystal structure of Lanthanum Aluminate is perovskite. LaAlO3 crystal are are commonly used as substrates for depositing high-temperature superconducting films. LaAlO3 thin flims have promising scientific and technological applications, such as in electronic transducers, thin film capacitors, computer memory cells.

Material Notes

Lanthanum Aluminate Sputtering Targets, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness <= 15 mm; Block: Length <= 120 +/-0.1 mm, Width <= 120 +/-0.1 mm,Thickness <= 15 mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.

Other Information of Lanthanum Aluminate Sputtering Targets

• Thermal barrier, catalyst
• Superconducting, solid oxide fuel cell

• Super capacitor
• Electromagnetic device

• High purity & Density
• Custom Sizes Available
• Single Phase 
• Relative Density: >=85%

Manufacturing Process
•  In-house powder synthesis, High purity metal oxide precursor materials, High energy mixing, Particle sizing processes
• Multiple step densification, Proprietary processes employed for pressing and sintering
• Cleaning and final packaging, Cleaned for use in vacuum, Protection from environmental contaminants, Protection during shipment
 99.9% Minimum Purity

• Custom compositions may be available upon request

• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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