Lanthanum Copper Manganate Sputtering Targets (La2CuMnO6)
| Material Type | Lanthanum Copper Manganate |
| Symbol | La2CuMnO6, LCMO |
| Color/Appearance | Various colors, Solid |
| Melting Point (°C) | N/A |
| Relative Density (g/cc) | >90% |
| Z Ratio | N/A |
| Sputter | RF, RF-R, DC |
|
Max Power Density* (Watts/Square Inch) |
N/A |
| Type of Bond | Indium, Elastomer |
| Comments |
Lanthanum Copper Manganate Sputtering Targets
Lanthanum Copper Manganate Sputtering Targets
Purity is 99.9%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.
More Information on Lanthanum Copper Manganate Sputtering Targets
Applications• Ferroelectric• Gate Dielectric • For CMOS
• Non-volatile Memory
• Thin film capacitor
|
Features• High purity• Custom Sizes Available |
Manufacturing Process• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate
• Cleaning and final packaging, Cleaned for use in vacuum, |
Options
• 99.99% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
|
Related Products of Lanthanum Copper Manganate Sputtering Targets
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Ceramic Sputtering Targets |
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Evaporation Materials |
Crucibles N/A |
Metal Powders Manganese Powder |
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