Lanthanum Sputtering Targets (La)


Material Type | Lanthanum |
Symbol | La |
Atomic Weight | 138.90547 |
Atomic Number | 57 |
Color/Appearance | Silvery White, Metallic |
Thermal Conductivity | 13 W/m.K |
Melting Point (°C) | 921 |
Coefficient of Thermal Expansion | 12.1 x 10-6/K |
Theoretical Density (g/cc) | 6.17 |
Z Ratio | 0.92 |
Sputter | RF |
Max Power Density* (Watts/Square Inch) |
20 |
UN Number | 2813 |
Comments | Films will burn in air if scraped. |
General
Lanthanum is a soft, ductile, silvery-white metallic chemical element with symbol La and atomic number 57. It tarnishes rapidly when exposed to air and is soft enough to be cut with a knife. It is the eponym of the lanthanide series, a group of 15 similar elements between lanthanum and lutetium in the periodic table, of which lanthanum is the first and the prototype. It is also sometimes considered the first element of the 6th-period transition metals and is traditionally counted among the rare earth elements. The usual oxidation state is +3. Lanthanum has no biological role in humans but is essential to some bacteria. It is not particularly toxic to humans but does show some antimicrobial activity.
Material Notes
Lanthanum Sputtering Targets, Purity is 99.9%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Other Information of Lanthanum Sputtering Targets
Applications • Electronics • Semiconductor • Flat panel displays |
Features • Competitive pricing • High purity • Grain refined, engineered microstructure • Semiconductor grade |
Manufacturing Process • Refining Three-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options • 99.999% minimum purity • Semiconductor grade aluminum alloys available Al/Si,Al/Cu,Al/Cu/Si • Planar circular targets up to 18'' (457mm) diameter • Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations • Smaller sizes also available for R&D applications • Sputtering target bonding service |


