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Lanthanum Ferrite Sputtering Targets (LaFeO3)

Lanthanum Ferrite Sputtering Targets (LaFeO3)
Material Type Lanthanum Ferrite
Symbol LaFeO3
Color/Appearance Various colors, Solid
Melting Point (°C) 977
Relative Density (g/cc) >90%
Z Ratio N/A
Sputter RF, RF-R, DC
Max Power Density*
(Watts/Square Inch)
N/A
Type of Bond Indium, Elastomer
Comments  

General

Lanthanum Ferrite (LaFO3) is one of the most common and well-known perovskite oxides, has attracted much attention because its excellent thermal and chemical stability. The Perovskite-type LaFeO3 has promising appilcations as as a negative-electrode material for Ni/metal-hydride batteries, and also widely used for electronic transducers, thin film capacitors, computer memory cells.

Material Notes

Lanthanum Ferrite Sputtering Targets, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness <= 15 mm; Block: Length <= 120 +/-0.1 mm, Width <= 120 +/-0.1 mm,Thickness <= 15 mm.  Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.
 


Other Information of Lanthanum Ferrite Sputtering Targets

Applications
• Thermal barrier, catalyst
• Superconducting, solid oxide fuel cell

• Super capacitor
• Electromagnetic device

• Negative-electrode material for Ni/metal-hydride batteries

Features
• High purity & Density
• Custom Sizes Available
• Single Phase 

Manufacturing Process
•  In-house powder synthesis, High purity metal oxide precursor materials, High energy mixing, Particle sizing processes
• Multiple step densification, Proprietary processes employed for pressing and sintering
 
• Cleaning and final packaging, Cleaned for use in vacuum, Protection from environmental contaminants, Protection during shipment
Options
• 99.9% Minimum Purity

• Custom compositions may be available upon request

• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
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