High Purity Materials
Thin Film Substrates
Titanium Disilicide Sputtering Targets (TiSi2)
|Material Type||Titanium Silicide|
|Melting Point (°C)||1,760|
|Theoretical Density (g/cc)||4.39|
|Sputter||RF, RF-R, DC|
|Type of Bond||Indium, Elastomer|
Titanium Disilicide Sputtering Targets
Titanium silicide (TiSi2) is an inorganic chemical compound. Titanium silicide is used in the semiconductor industry. It is typically produced by utilizing silicide technology over silicon and polysilicon lines to reduce the sheet resistance of local transistor connections. Titanium silicide (TiSi2) sputtering targets are excellent materials used in hardware coating because of the useful properties of high hardness, low wear, impact resistance, and thermal shock.
Titanium Disilicide Sputtering Targets Information
Titanium silicide (TiSi2) Sputtering Targets
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material may require a special ramp up and ramp down procedures. This process may not be necessary for other materials. Targets that have low thermal conductivity are susceptible to thermal shock.
More Information on Tungsten Disilicide Sputtering Targets
• High purity
• Custom sizes available
• Cleaning and final packaging, Cleaned for use in vacuum,
• 99.95% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service