Titanium Nitride Sputtering Targets (TiN)
| Material Type | Titanium Nitride |
| Symbol | TiN |
| Color/Appearance | Yellow-Brown, Crystalline Solid |
| Melting Point (°C) | 2,930 |
| Theoretical Density (g/cc) | 5.4 |
| Z Ratio | **1.00 |
| Sputter | RF, RF-R |
|
Max Power Density* (Watts/Square Inch) |
20 |
| Type of Bond | Indium, Elastomer |
| Comments | Sputtering preferred. Decomposes with thermal evaporation. |
Titanium Nitride Sputtering Targets
Titanium nitride (TiN) (sometimes known as tinite) is an extremely hard ceramic material, often used as a coating on titanium alloys, steel, carbide, and aluminum components to improve the substrate's surface properties.
Titanium Nitride Sputtering Targets Information
Titanium Nitride Sputtering Targets
Purity: 99.5%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material may require a special ramp up and ramp down procedures. This process may not be necessary for other materials. Targets that have low thermal conductivity are susceptible to thermal shock.
More Information on Titanium Nitride Sputtering Targets
Applications• Chemical Vapor Deposition (CVD)• Physical Vapor Deposition (PVD) • Semiconductor • Optical |
Features• High purity• Custom sizes available |
Manufacturing Process• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate
• Cleaning and final packaging, Cleaned for use in vacuum, |
Options
• 99.5% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
|
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