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Titanium Nitride Sputtering Targets (TiN)

Titanium Nitride Sputtering Targets (TiN)
Material Type Titanium Nitride
Symbol TiN
Color/Appearance Yellow-Brown, Crystalline Solid
Melting Point (°C) 2,930
Theoretical Density (g/cc) 5.4
Z Ratio **1.00
Sputter RF, RF-R
Max Power Density*
(Watts/Square Inch)
20
Type of Bond Indium, Elastomer
Comments Sputtering preferred. Decomposes with thermal evaporation.

General

Titanium nitride (TiN) (sometimes known as tinite) is an extremely hard ceramic material, often used as a coating on titanium alloys, steel, carbide, and aluminium components to improve the substrate's surface properties.

Material Notes

Titanium Nitride Sputtering Target, Purity is 99.5%;  Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.
 



Other Information of Titanium Nitride Sputtering Targets

Applications
  PVD (physical vapor deposition) and CVD (chemical vapor) deposition display
• Semiconductor

• Optical

Features
• High purity
• Custom Sizes Available

Manufacturing Process
• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

Options
• 99% Minimum Purity

• Up to 12'' Diameter Targets Available

• Planar Tiles Up to 8'' X 5'' for Larger Target Configurations

 
 
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