Thin Film Substrate
Precious Metals, such as Gold, Silver and Platinum are used in the field of Semiconductor and Microelectronics. Precious Metals thin film players can serve as barrier against oxidation for retaining good electrical connectivity, as medium for soldering, as electrical contact layer, as alloy constituent for semiconductor effects, such as in Schottky or Zener Diodes, connecting layers, as a base fro wire bonding, and for other applications.
AEM Deposition, a globally active business, is one of the leading producers of coating materials for physical vapor deposition (PVD) more than 10 years experience in this field. Its semiconductor portfolio covers a wide range of highly effective sputtering targets and evaporation materials. Meanwhile, AEM Deposition also provides target bonding service, evaporation source (crucible, evaporation boats, thermal filaments), and substrates & wafers. Good international reputation is the assurance of quality.
Gold Sputtering Targets (Au), purity: 99.99-99.999%
Sliver Sputtering Targets (Ag), purity: 99.99%
Iridium Sputtering Targets (Ir), purity: 99.9%
Palladium Sputtering Targets (Pd), purity: 99.95%
Platinum Sputtering Targets (Pt), purity: 99.99%
Rhodium Sputtering Targets (Rh), purity: 99.95%
Ruthenium Sputtering Targets (Ru), purity: 99.9%
Copper Silver Sputtering Targets (Cu/Ag), purity: 99.9%
Gold Copper Sputtering Targets (Au/Cu), purity: 99.9%
Gold Palladium Sputtering Targets (Au/Pd), purity: 99.9%
Gold Tin Sputtering Targets (Au/Sn), purity: 99.9%
Silver Palladium Sputtering Targets (Ag/Pd), purity: 99.9%
Iridium Manganese Sputtering Targets (Ir/Mn), purity: 99.9%
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Most of precious metals can be processed by melting, casting, and subsequent thermo-mechanical transformation. For some precious metal alloy and selected precious metals, such as Iridium, powder processing is the established processing route. AEM Deposition can provide products manufactured with state of the art processes best suited for each individual precious metal or precious metal alloy.
All materials are tested in our leading edge analytical laboratory or one of our associate laboratories:
Hot gas extraction (LECO)
Induction coupled plasma optical emission spectrometry (ICP-OES)
Glow discharge mass spectrometry (GDMS)
In all products obtained by melting and casting full density (100% of theoretical) is obtained. Products manufactured by the powder metal-liturgical process are provided with highest possible density available according to best know practice.
AEM Deposition thin film products uses its own proprietary target bonding method, based on a flux-free solder technique. Thin film adhesion and diffusion barrier layers are applied to the back of each precious metal sputtering targets, followed by a temperature controlled metallic solder seal between precious metal target and backing plate. The bonding is compliant to accommodate mechanical and thermal stress.
Final cleaning and packaging is completed under clean-room conditions. All precious metal targets are vacuum sealed in argon-filled polyethylene bags, guaranteeing consistent sputtering target performance, even when stored for a longer period of time.