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Germanium Antimony Telluride Sputtering Targets (Ge2Sb2Te5)

Germanium Antimony Telluride Sputtering Targets (Ge2Sb2Te5)
Material Type Germanium Antimony Telluride
Symbol Ge2Sb2Te5, GST
Color/Appearance Grey, Solid
Melting Point (°C) >600
Theoretical Density (g/cc) 6.35
Water Solubility Insoluble
Sputter RF, RF-R, DC
Type of Bond Indium, Elastomer


GeSbTe is a ternary compound of germanium, antimony, and tellurium, with composition GeTe-Sb2Te3. This material is not stable because of its low activation energy. On the other hand, materials with good amorphous stability like GeTe has slow crystallization speed because of its high activation energy. In its stable state, crystalline GeSbTe has two possible configurations: hexagonal and a metastable face centered cubic (FCC) lattice. GeSbTe also has many vacancy defects in the lattice, of 20 to 25% depending on the specific GeSbTe compound. GeSbTe is generally P type and there are many electronic states in the band gap accounting for acceptor and donor like traps. GeSbTe has two stable states, crystalline and amorphous.

Material Notes

Germanium Antimony Sputtering Target, Purity is 99.99%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Other Information of Germanium Antimony Telluride Sputtering Targets

• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display

Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment

99.999% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service



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