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AEM Deposition

Tellurium Sputtering Targets (Te)

Tellurium Sputtering Targets (Te)
Tellurium Sputtering Targets (Te)
Material Type Tellurium
Symbol Te
Atomic Weight 127.6
Atomic Number 52
Color/Appearance Silvery Lustrous Gray, Semi-Metallic
Thermal Conductivity 3 W/m.K
Melting Point (°C) 449
Theoretical Density (g/cc) 6.25
Z Ratio 0.9
Sputter RF
Type of Bond Indium, Elastomer
UN Number 3284
Comments Wets without alloying. 

Tellurium Sputtering Target

Tellurium has two allotropes, crystalline and amorphous. When crystalline, tellurium is silvery-white with a metallic luster. It is a brittle and easily pulverized metalloid. Amorphous tellurium is a black-brown powder prepared by precipitating it from a solution of tellurous acid or telluric acid (Te(OH)6). Tellurium is a semiconductor that shows a greater electrical conductivity in certain directions depending on atomic alignment; the conductivity increases slightly when exposed to light (photoconductivity). When molten, tellurium is corrosive to copper, iron, and stainless steel. Of the chalcogens, tellurium has the highest melting and boiling points, at 722.66 K (841.12 ℉) and 1,261 K (1,810 ℉), respective.

Tellurium Sputtering Target Information

Tellurium Sputtering Targets
Purity is 99.999%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Some materials and manufacturing methods may yield product with higher than average porosity. Performance may be affected according to process requirements.

Other Information of Tellurium Sputtering Target


• Electronics
• Semiconductor
• Flat panel displays


• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process

• Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment


• 99.99% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

Related Products of Tellurium Sputtering Target

Ceramic Sputtering Targets
Evaporation Materials
Metal Powders

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