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Cerium Bismuth Ferrite Sputtering Targets (Ce2.2Bi0.8Fe5O12)

Cerium Bismuth Ferrite Sputtering Targets (Ce2.2Bi0.8Fe5O12)
Material Type Cerium Bismuth Ferrite
Symbol Ce2.2Bi0.8Fe5O12
Color/Appearance Various colors, Solid
Melting Point (°C) N/A
Relative Density (g/cc) >90%
Z Ratio N/A
Sputter RF, DC
Max Power Density*
(Watts/Square Inch)
 
Type of Bond Indium, Elastomer
Comments  

General

Material Notes

Cerium Bismuth Ferrite Sputtering Targets, Purity is 99.99%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
 


Other Information of Cerium Bismuth Ferrite Sputtering Targets

Applications
  Ferroelectric
• Gate Dielectric

• For CMOS

Features
• High purity
• Custom Sizes Available

Manufacturing Process
• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

Options
99.9% ex Strontium Minimum Purity

•Up to 12'' Diameter Targets Available

•Planar Tiles Up to 8'' X 5'' for Larger Target Configurations

 
 
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