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Titanium Ferrite Sputtering Targets (TiFe2O4)

Titanium Ferrite Sputtering Targets (TiFe2O4)
Material Type Titanium Ferrite
Symbol TiFe2O4
Color/Appearance Various colors, Solid
Melting Point (°C) N/A
Theoretical Density (g/cc) N/A
Water Solubility Insoluble
Sputter RF, RF-R, DC
Type of Bond Indium, Elastomer
Comments  

General


Material Notes

Titanium Ferrite Sputtering Target, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.
 



Other Information of Titanium Ferrite Sputtering Targets

Applications
  Ferroelectric
• Gate Dielectric

• For CMOS

Features
• High purity
• Custom Sizes Available

Manufacturing Process
• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

Options
• 99.9% ex Strontium Minimum Purity

• Up to 12'' Diameter Targets Available

• Planar Tiles Up to 8'' X 5'' for Larger Target Configurations

 
 
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