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Zinc Sputtering Targets (Zn)

Zinc Sputtering Targets (Zn)
Material Type Zinc
Symbol Zn
Atomic Weight 65.38
Atomic Number 30
Color/Appearance Bluish Pale Gray, Metallic
Thermal Conductivity 116 W/m.K
Melting Point (°C) 420
Coefficient of Thermal Expansion 30.2 x 10-6/K
Theoretical Density (g/cc) 7.14
Z Ratio 0.514
Sputter DC
Max Power Density*
(Watts/Square Inch)
50
Type of Bond Indium, Elastomer
Comments Evaporates well under wide range of conditions.

General

Zinc is a bluish-white, lustrous, diamagnetic metal, though most common commercial grades of the metal have a dull finish. It is somewhat less dense than iron and has a hexagonal crystal structure, with a distorted form of hexagonal close packing, in which each atom has six nearest neighbors (at 265.9 pm) in its own plane and six others at a greater distance of 290.6 pm. The metal is hard and brittle at most temperatures but becomes malleable between 100 and 150 . Above 210 ℃, the metal becomes brittle again and can be pulverized by beating. Zinc is a fair conductor of electricity. For a metal, zinc has relatively low melting (419.5 ℃) and boiling points (90).

Material Notes

Zinc Sputtering Targets, Purity is 99.99, 99.995%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
 


Other Information of Zinc Sputtering Targets

Applications
Electronics
• Semiconductor
• Flat panel displays
Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment
Options
99.999% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• 
Planar tiles up to 48''(1200mm) X 15.75''(400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
 
 

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