Semiconductor Sputtering Targets

views, Updated: 2021-09-24

Sputtering targets must meet stricter standards for high-quality ever to produce sub-micron scale and wafer targets in ever-larger sizes.

 

- Low particle

 

- Good film uniformity

 

- High usage efficiency

- Low-particle targets

 

- ULVAC has developed sputtering targets that suppress the generation of particles that can be the source of problems in the sputtering process.

 

- Gaseous elements are one factor in causing particle emissions, especially in aluminum targets. We are working to lower emissions by utilizing a vacuum melting method for refining and ingot purification processes.

 

- Attaining high uniformity by adjusting the metal microstructure

 

- ULVAC uses manufacturing processes that ensure high uniformity and a fine metal microstructure in most of its targets for semiconductor products, including high purity cobalt targets and titanium targets.

 

- Utilizing a fine metal microstructure with a high degree of uniformity allows uniform magnetic flux leakage on the target surface of high purity cobalt targets.

 

- Meticulous quality control system

 

- Integrated process manufacturing at ULVAC takes product characteristics and contours into account during production. Sophisticated analysis/evaluation system such as the GD-MS (glow discharge mass spectrometer) ensures purity and a high level of quality.