Copper Substrate (Cu)
Copper Substrate
Copper (Cu) single crystal substrate is widely used in matrix metals, alloy film materials, and biomaterials.
Copper Substrate Physical Properties
| Material | Copper |
|---|---|
| Crystal Structure | M3 |
| Growth Method | Bridgman Method |
| Lattice (A) | a=3.607 |
| Density(g/cm3) | Dx=8.989（g/cm3）;Dm=8.95（g/cm3） |
| Purity | >4N |
| Melting Point | 1083℃ |
Copper Substrate Specifications
| Size | 10x3, 10x5, 10x10, 15x15, 20x15, 20x20 |
|---|---|
| Customized sizes are available on demand. | |
| Thickness | 0.5 mm, 1.0 mm |
| Crystal Orientation | ＜100＞ <110> ＜111> |
| Polished | SSP or DSP |
| Redirection Precision | ±0.5° |
| Redirection the Edge | 2°（special in 1°） |
| Angle of Crystalline | Customized sizes are available on demand. |
| Ra: | ≤5Å（5µm×5µm） |
Copper Substrate Package
Packaged with class 100 clean bag or wafer container in a class 1000 clean room.
Related Products of Copper Substrate
|
Magnetic Ferroelectricity Substrates |
Semiconductor Wafers |
|
|
GaN Thin Film Substrates |
Halide Substrates |
Ceramic Substrates |
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