Alumina Ceramic Substrate (Al2O3)
Alumina Ceramic Substrate
The Alumina (Al2O3) ceramic substrate has low thermal conductivity (20W/m.K). It is a widely used ceramic substrate because of its relatively simple production process, low cost, and low price.
Alumina Ceramic Substrate Physical Properties
| Material | Al2O3 |
|---|---|
| Purity | 96%, 99%, 99.5% |
| Density(g/cm3) | 3.78 g/cm3 |
| Hardness | 9.2(Mohns) |
| Thermal Conductivity (W/m. K) | 26 |
| Thermal Expansion (x10-6/oC) | 7.2x10－6 |
| Dielectric Constant (at 1MHZ) | 9.6 |
| Flexural Strength (N/mm2) | 380 |
| Loss Tangent (x10-4 @1MHZ) |
3.0x10－4 |
Alumina Ceramic Substrate Specification
| Size |
100 x 100 x 1.0 mm (customized sizes are available) |
|---|---|
| Ra: | polished <0.01um, |
Related Products of Alumina Ceramic Substrate
|
Magnetic Ferroelectricity Substrates |
Semiconductor Wafers |
|
|
GaN Thin Film Substrates |
Halide Substrates |
Ceramic Substrates |
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