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  • Comparison of Utilization Ratio Between Planar and Rotating Sputtering Target

    The commonly used sputtering targets for large area coating are divided into planar targets and rotating sputtering targets according to their shapes. The commonly used planar sputtering targets include copper sputtering targets, silver sputtering targets, nickel chromium sputtering targets and graphite sputtering targets. The commonly used rotating sputtering targets include zinc aluminum sputtering targets, zinc tin sputtering targets, silicon aluminum sputtering targets, tin sputtering targets, titanium oxide sputtering targets and zinc aluminum oxide sputtering targets. The shape of sputtering target directly affects the stability and film characteristics of magnetron sputtering coating, as well as the utilization rate of the target. Therefore, the quality and production efficiency of the coating can be improved by changing the shape design of the target, so as to save costs.
    Utilization ratio of planar sputtering target
    In the magnetron sputtering process, due to the different intensity of the magnetic field distribution (the magnetic field in the tangent direction is the strongest), there is a ring-shaped "runway" (as shown in Figure 1) in the surface area of the target during the sputtering process, and the utilization rate of the target is low (only about 35%).
    When the planar target is used, the material thickness of the runway can be thickened according to the actual magnetic field distribution to improve the target utilization rate and production efficiency. However, it is difficult to form a large-scale planar target, so it is necessary to prepare a small-scale target for splicing. The splicing gap can provide space for thermal expansion of the target, but when the gap is large, it is easy to have air residues, which makes it difficult to vacuum. In the process of coating, the release of residual gas will affect the quality and uniformity of the film, so the gap size should be considered in the target size design process, generally around 0.5mm is better. AEM Deposition can provide large-scale flat sputtering target with large area coating. The details are as follows:

    Copper Sputtering Target Silver Sputtering Target Nickel Sputtering Target Chromium Sputtering Target
    Carbon Sputtering Target      
    Utilization ratio of rotating sputtering target
    For the rotating target, the target rotates and the sputtering area changes continuously during the sputtering process, so there is almost no sputtering track similar to the planar target. However, in the process of magnetron sputtering, the ring design of the magnet inside the magnet steel makes the magnetic field have certain edge effect, that is, the strength of the end of the target magnetic field is not consistent with that of the middle straight-line area.
    Because of the high intensity of the end magnetic field and the influence of the orthogonal electromagnetic field on the sputtering ions, the sputtering rate at the end is fast and uneven etching phenomenon occurs. For the rotating target with straight tube shape, when the material in the middle is thick, the sputtering at the edge is narrow and the utilization ratio is generally low. Therefore, the rotating target is generally designed as dog bone (i.e. small diameter in the middle and large diameter at both ends, as shown in Figure 2), so as to improve the utilization rate of the target (the utilization rate can reach more than 80%) and save production cost.
    AEM deposition can provide rotating sputtering targets for large area coating. The details are as follows:
    Rotatable Aluminum Sputtering Target Rotatable Chromium Sputtering Target Rotatable Copper Sputtering Target Rotatable Molybednum Sputtering Target
    Rotatable Silicon Sputtering Target Rotatable Tantalum Sputtering Target Rotatable Niobium Sputtering Target Rotatable Titanium Sputtering Target
    Rotatable Zirconium Sputtering Target Rotatable Nickel Chromium Sputtering Target Rotatable Nickel Vanadium Sputtering Target Rotatable Tungsten Titanium Sputtering Target
    Rotatable ITO Sputtering Target Rotatable GZO Sputtering Target Rotatable IGZO Sputtering Target Rotatable IZO Sputtering Target
    Rotatable AZO Sputtering Target Rotatable Titanium Dioxide Sputtering Target Rotatable Niobium Oxide Sputtering Target  

    The shape design of target mainly affects the utilization rate of sputtering target. Reasonable size design can improve the utilization rate of target and save cost. Therefore, enterprises should choose the appropriate sputtering target materials according to their own needs.
    AEM deposition, as a professional sputtering target manufacturer, supplies all kinds of pure metal sputtering target, alloy sputtering target and ceramic compound sputtering target. The details are as follows:
    Pure Metal Sputtering Target Alloy Sputtering Target Oxide Sputtering Target Sulfide Sputtering Target
    Boride Sputtering Target Carbide Sputtering Target Silicide Sputtering Target
    Telluride Sputtering Target Nitride Sputtering Target Fluoride Sputtering Target  

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